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School Moisture Mitigation System

Glue Removal and Shot Blast

Adhesive Removal

Shot Blast

Glue removal with diamond grinder and shot blast to create a CSP of 3 for an epoxy moisture mitigation system.

  1. Total Project Size: 8,560 square feet
  2. Remove existing adhesives with diamond grinder
  3. Shot blast to create a Concrete Surface Profile (CSP) of 3
  4. Edge grind to create a CSP of 1-2
  5. Job Duration: 1 day

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